Microelectronics Packaging Solutions

Development of custom solutions to solve microelectronics packaging problems: Electrical, mechanical and thermal design

Development of Custom enclosures for low frequency and high frequency systems including multi-channel and multi-boards assemblies

Development of Hybrid/MIC (Chip and Wire) assemblies for RF and microwave circuits/systems. This is a lower cost and lower risk alternative to MMIC technology while still providing excellent performance

Multi-Chip Modules (MCM) Design, Assembly and testing. MCM assemblies optimize SWaP (Space, Weight and power) compared to connectorized assemblies.

SMD Soldering per IPC-J-STD-001 Standard. hand-soldering of 0201 and 01005 size surface mount components for small /prototyping volume